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  composite transistors 1 publication date: december 2003 sjj00230bed XN04407 (xn4407) silicon pnp epitaxial planar type for general amplification features ? two elements incorporated into one package ? reduction of the mounting area and assembly cost by one half basic part number ? 2sb0709a (2sb709a) + 2sb0970 (2sb970) absolute maximum ratings t a = 25 c marking symbol: es internal connection 5 4 3 2 1 6 tr2 tr1 note) the part number in the parenthesis shows conventional part number. parameter symbol rating unit tr1 collector-base voltage v cbo ? 60 v (emitter open) collector-emitter voltage v ceo ? 50 v (base open) emitter-base voltage v ebo ? 7v (collector open) collector current i c ? 100 ma peak collector current i cp ? 200 ma tr2 collector-base voltage v cbo ? 15 v (emitter open) collector-emitter voltage v ceo ? 10 v (base open) emitter-base voltage v ebo ? 7v (collector open) collector current i c ? 500 ma peak collector current i cp ? 1a overall total power dissipation p t 300 mw junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c unit: mm 1: collector (tr1) 4: collector (tr2) 2: base (tr2) 5: base (tr1) 3: emitter (tr2) 6: emitter (tr1) eiaj: sc-74 mini6-g1 package 2.90 1.9 0.1 0.16 +0.10 ?0.06 2.8 +0.2 ?0.3 1.1 +0.3 ?0.1 1.1 0 to 0.1 +0.2 ?0.1 1.50 0.65 0.15 0.4 0.2 +0.25 ?0.05 0.95 0.30 +0.10 ?0.05 0.50 +0.10 ?0.05 0.95 6 5 4 1 32 +0.20 ?0.05 5? 10?
XN04407 2 sjj00230bed ? tr2 electrical characteristics t a = 25 c 3 c ? tr1 common characteristics chart p t ? t a 0 160 40 120 80 0 500 200 400 100 300 total power dissipation p t ( mw ) ambient temperature t a ( c ) parameter symbol conditions min typ max unit collector-base voltage (emitter open) v cbo i c = ? 10 a, i e = 0 ? 60 v collector-emitter voltage (base open) v ceo i c = ? 2 ma, i b = 0 ? 50 v emitter-base voltage (collector open) v ebo i e = ? 10 a, i c = 0 ? 7v collector-base cutoff current (emitter open) i cbo v cb = ? 20 v, i e = 0 ? 0.1 a collector-emitter cutoff current (base open) i ceo v ce = ? 10 v, i b = 0 ? 100 a forward current transfer ratio h fe v ce = ? 10 v, i c = ? 2 ma 160 460 ? collector-emitter saturation voltage v ce(sat) i c = ? 100 ma, i b = ? 10 ma ? 0.3 ? 0.5 v transition frequency f t v cb = ? 10 v, i e = 1 ma, f = 200 mhz 80 mhz collector output capacitance c ob v cb = ? 10 v, i e = 0, f = 1 mhz 2.7 pf (common base, input open circuited) note) measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. parameter symbol conditions min typ max unit collector-base voltage (emitter open) v cbo i c = ? 10 a, i e = 0 ? 15 v collector-emitter voltage (base open) v ceo i c = ? 1 ma, i b = 0 ? 10 v emitter-base voltage (collector open) v ebo i e = ? 10 a, i c = 0 ? 7v collector-base cutoff current (emitter open) i cbo v cb = ? 10 v, i e = 0 ? 0.1 a forward current transfer ratio * h fe1 v ce = ? 2 v, i c = ? 500 ma 100 350 ? h fe2 v ce = ? 2 v, i c = ? 1 a 60 collector-emitter saturation voltage v ce(sat) i c = ? 400 ma, i b = ? 8 ma ? 0.16 ? 0.30 v base-emitter saturation voltage v be(sat) i c = ? 400 ma, i b = ? 8 ma ? 0.8 ? 1.2 v transition frequency f t v cb = ? 10 v, i e = 50 ma, f = 200 mhz 130 mhz collector output capacitance c ob v cb = ? 10 v, i e = 0, f = 1 mhz 22 pf (common base, input open circuited) note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * : pulse measurement
XN04407 3 sjj00230bed characteristics charts of tr1 i c ? v ce i c ? i b i b ? v be i c ? v be v ce(sat) ? i c h fe ? i c c ob ? v cb 0 ? 12 ? 10 ? 8 ? 2 ? 6 ? 4 0 ? 120 ? 100 ? 80 ? 60 ? 40 ? 20 t a = 25 c ? 250 a ? 200 a ? 150 a ? 100 a ? 50 a i b = ? 300 a collector-emitter voltage v ce (v) collector current i c (ma) 0 ? 1.0 ? 0.2 ? 0.8 ? 0.6 ? 0. 4 ? 1.2 0 ? 160 ? 120 ? 100 ? 80 ? 40 ? 20 ? 60 ? 140 v ce = ? 10 v t a = 25 c base current i b ( ma ) collector current i c ( ma ) 0 ? 0.8 ? 0.2 ? 0.4 ? 0.6 0 ? 4.0 ? 3.0 ? 1.0 ? 2.5 ? 3.5 ? 2.0 ? 0.5 ? 1.5 v ce = ?10 v t a = 25 c base-emitter voltage v be (v) base current i b ( ma ) 0 ? 1.0 ? 0.8 ? 0.2 ? 0.6 ? 0.4 0 ? 120 ? 100 ? 80 ? 60 ? 40 ? 20 v ce = ? 10 v t a = 75 c ? 25 c 25 c base-emitter voltage v be (v) collector current i c (ma) ? 1 ? 10 ? 10 2 ? 10 3 ? 10 ? 3 ? 10 ? 2 ? 10 ? 1 ? 1 ? 10 i c / i b = 10 t a = 75 c 25 c ? 25 c collector-emitter saturation voltage v ce(sat) (v) collector current i c (ma) ? 10 ? 1 ? 1 ? 10 2 ? 10 3 ? 10 0 600 500 400 300 200 100 forward current transfer ratio h fe collector current i c (ma) v ce = ? 10 v 25 c ? 25 c t a = 75 c 0 ? 10 ? 20 ? 30 ? 40 10 1 f = 1 mhz t a = 25 c collector output capacitance (common base, input open circuited) c ob (pf) collector-base voltage v cb ( v )
XN04407 4 sjj00230bed characteristics charts of tr2 i c ? v ce v be(sat) ? i c v ce(sat) ? i c h fe ? i c c ob ? v cb 0 0 ? 6 ? 1 ? 5 ? 2 ? 4 ? 3 ? 100 ? 300 ? 200 ? 400 ? 350 ? 250 ? 150 ? 50 collector-emitter voltage v ce (v) collector current i c (ma) t a = 25 c i b = ? 10 ma ? 9 ma ? 8 ma ? 7 ma ? 6 ma ? 5 ma ? 4 ma ? 3 ma ? 2 ma ? 1 ma i c / i b = 50 t a = ? 25 c 25 c 75 c base-emitter saturation voltage v be(sat) ( v ) collector current i c ( ma ) ? 10 ? 10 2 ? 10 3 ? 10 4 ? 10 ? 3 ? 10 ? 2 ? 10 ? 1 ? 1 ? 10 ? 10 ? 10 2 ? 10 3 ? 10 4 ? 10 ? 3 ? 10 ? 2 ? 10 ? 1 ? 1 ? 10 t a = 75 c ? 25 c 25 c i c / i b = 50 collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( ma ) ? 1 ? 10 ? 10 2 ? 10 3 0 400 300 100 250 350 200 50 150 v ce = ? 2 v ? 25 c 25 c t a = 75 c forward current transfer ratio h fe collector current i c ( ma ) 0 ? 4 ? 8 ? 12 ? 16 10 3 1 10 10 2 f = 1 mhz t a = 25 c collector output capacitance (common base, input open circuited) c ob (pf) collector-base voltage v cb ( v )
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep


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